Igeekphone News, October 31st: Today, the blogger Digital Chat Station released the detailed parameters of Mediatek’s Dimensity 8500, which is a mid-range performance chip.
It is built with TSMC’s 4nm process and features an 8-core A725 all-large core architecture. Currently, the main frequency of the super-large core in the prototype test is 3.4GHz, integrating a Mali-G720 GPU with a frequency of 1.5GHz±. The Antutu benchmark score is 2.2W ±, and the theoretical performance of the GPU exceeds that of the Snapdragon 8 Gen3/8s Gen4.
In addition, the ISP and peripherals of the Dimensity 8500 have also been upgraded to a certain extent, which can enhance the experience of other aspects of the corresponding terminal.
According to leaks, the REDMI Turbo 5 will be the world’s first to release the Dimensity 8500, with its release date set for the end of the year.
In addition to performance upgrades, the Turbo 5 will also be upgraded to a metal frame and a large R-corner design, significantly enhancing the texture and aligning with the Pro.
The screen remains a 6.6-inch 1.5K design, and the overall appearance is still minimalist. It is expected to maintain a dual-camera setup.
This device will also be equipped with a large-capacity battery of over 7000mAh, significantly enhancing its battery life.
The REDMI Turbo 4 was released in January this year. It features a 6.67-inch 1.5K straight screen, a 20-megapixel front camera, and a 50-megapixel main camera and an 8-megapixel ultra-wide-angle rear camera.
The core is equipped with Mediatek Dimensity 8400-Ultra, and it is built with a 6550mAh Xiaomi Jinsha River battery. It supports 90W fast charging and can charge 100% in 45 minutes.
In addition, the Turbo 4 supports IP66&IP68&IP69 dust and water resistance, tri-band Beidou + dual-band GPS, and is equipped with the Pengpai OS 2 system.