MediaTek Presents Helio P60: 12nm FinFET and With Integrated AI Support

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MediaTek is back in the new edition of the Mobile World Congress 2018, officially introducing the new mid-range SoC, Helio P60, the first for this manufacturer to be equipped with a multi-core AI processing unit (mobile APU) and a technology proprietary MediaTek NeuroPilot AI call.

Inside Helio P60 hides an octa-core architecture, realized with a 12nm FinFET production process and is divided into four ARM Cortex-A73 and four ARM Cortex-A53 cores, with a clock frequency for all at 2 GHz Using the so-called big.LITTLE configuration, tasks that require more power can use the A73 cores, while lighter operations, which require less workload, use the A53s to conserve battery life.

The purchased graphic improves with respect to the previous solutions adopted by the manufacturer, Helio P60 exploits, in fact, a Mali-G72 MP3 GPU, with a clock that can reach up to 800 MHz. It is 2 times more power efficient than using a GPU and has a processing performance of 280GMAC/s.

The new octa-core configuration allows an increase in performance up to 70% compared to previous Helio P23 and P30, and thanks to the use of NeuroPilot AI technology, energy efficiency optimizes consumption, while offering maximum performance. MediaTek’s NeuroPilot SDK supports the Neural Networks Android APIs, as well as some of the most common AI frameworks, such as TensorFlow, TF Lite, Caffe, and Caffe2.

Significant improvements also come from the photographic point of view, Helio P60 integrates, in fact, three ISPs that have been power-optimized and save up to 500mW of power or 18% reduction in power consumption over the previous generation, supports dual rear camera configuration and up to 2 modules of 16MP + 20MP or only 23MP. The integration with an APU will allow you to take advantage of some interesting features such as object recognition, AR + VR technologies, photo editing and video preview in real time and much more.

Finally, MediaTek Helio P60 includes an LTE WorldMode 4G modem, equipped with a 4L VoLTE and TAS 2.0 dual antenna to provide seamless global connectivity. The first smartphones equipped with this new processor will be available from the beginning of the second quarter of 2018.

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