iGEEKPHONE July 23rd News: According to the well-known digital blogger @Digital Chat Station, OPPO’s large-cup model X9 Pro this year will be equipped with Mediatek’s most powerful processor, Dimensity 9500, and for the first time, it will be fitted with a 200-megapixel periscope telephoto lens.
According to the leaked information, the Mediatek Dimensity 9500 chip is manufactured based on TSMC’s third-generation 3nm process N3P, featuring a full-core architecture consisting of 1*Travis+3*Alto+4*Gelas, with a main frequency exceeding 4GHz. Among them, Travis and Alto are Arm’s new-generation X9 series super-large cores. Gelas supports the SME instruction set and is a new generation of Arm A7 series large core.
In terms of imaging, the OPPO Find X9 Pro is the first phone in this series to be equipped with a 200-megapixel periscope telephoto lens. It is expected to be the Samsung HP5 model. This sensor adopts a 28nm process, with a single pixel size of 0.5μm, a large sensor size of 1/1.56 inches, and supports DCG-HDR.
Compared with its predecessor, the X8 Pro, the camera configuration of the X9 Pro has been adjusted, from 4 lenses to 3 lenses. Besides a 200-megapixel periscope, it is also equipped with a 50-megapixel main camera and a 50-megapixel ultra-wide-angle lens.
The previous generation’s quad-camera dual-periscope telephoto configuration included a 50-megapixel 3X periscope and a 50-megapixel 6X periscope telephoto lens. To accommodate the 200-megapixel ultra-large sensor periscope module, the X9 Pro made this adjustment. We might as well view this change as a technical trade-off and optimization.