Igeekphone reported on March 12th: Blogger @DigitalXiaolianTiaoZhan revealed today that a certain factory’s new 16GB LPDDR6 + 1TB UFS 5.0 solution has begun mold production. The SM8975 model is undergoing testing, and currently only the top-end version is planned. The cost of this memory has far exceeded the cost of the SM8975 SoC. Based on this blogger’s previous reporting habits, it is expected that this is a new model from Xiaomi.
According to the previous revelations of this blogger, the next-generation flagship chips of Qualcomm, namely SM8950 and SM8975, both adopt the TSMC N2p process. Currently, only SM8975 supports LPDDR6+ full GPU+ full cache. Among them, Qualcomm’s SM8975 has an extremely high cost. Among the several iterations of the devices, the mid-range model is SM8950, and there is a low probability of being adjusted to N-1 SM8850 (Qualcomm Snapdragon 8 Elite Gen 5).
It is currently unclear what the specific names of these two chips will be. SM8975 is expected to be named Snapdragon 8 Elite Gen6 Pro, while SM8950 is likely to be named Snapdragon 8 Elite Gen6. The official announcement will provide the final details.
For more information about Xiaomi’s new model and Qualcomm’s flagship chip, those interested can follow up on the subsequent reports from Igeekphone.