Huawei took advantage of the IFA to announce that its next chip for smartphones, the Kirin 980, will be the first to be engraved with a fineness of 7 nm. It will equip its new smartphone, the Mate 20, whose official release is set for October 16. Huawei CEO Richard Yu revealed the new Kirin 980 System-on-Chip at IFA 2018. This chip is the first in the world to be produced (by TSMC ) with finesse engraving of 7 nm. The benefits of finer engraving are lower energy consumption (up to 40% lower than that of a 10-nm chip) and higher performance.
It is also the first to use the latest ARM architecture: Cortex-A76 and Mali G76 with eight cores of different sizes (two at 2.6 GHz, two at 1.92 GHz and four at 1.8 GHz), plus a 4G modem capable of reaching 1.4Gb / s of bandwidth.
In addition, Huawei is also releasing its own mobile device 5G baseband, which is named Balong 5000. Huawei did not disclose the specific details of the Balong 5000, but the Kirin 980 can support this baseband.
According to previous news, Qualcomm’s next-generation chips will also be equipped with X50 baseband supporting 5G, and the same as the Kirin 980 using TSMC 7nm process. It can be seen that the 5G battle between the two giants is ready to go.
The Kirin 980 also has two neural processing units (NPUs), subprocessors dedicated to artificial intelligence. Huawei says its chip is almost twice as fast as Qualcomm’s Snapdragon 845 and three times faster than Apple’s A11 chip for image recognition (based on tests done with Resnet 50). It goes without saying that it was designed to be compatible with the Balong 5000 5G modem developed by Huawei.
Read Also: Huawei Released Kirin 980 Chip: With Mate 20 Series Launch Set For October
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