Igeekphone December 11 news, according to the blogger “digital chat station” revealed that Mediatek Dimensity 8400 chip is tentatively scheduled to be released on December 23.
It is reported that Dimensity 8400 is based on TSMC 4nm process, using Cortex-A725 full core architecture design, CPU frequency of the highest breakthrough of 3GHz, and integrated with the same GPU IP of Dimensity 9400 (the GPU of Tianguet 9400 is the GPU Immortalis-G925 MC12), Antutu runs up to 180W+.
As a reference, the Snapdragon 8 Gen2 runs 160W+, and the Snapdragon 8 Gen3 runs 200W+, so the performance strength of the Dimensity 8400 can be seen.
REDMI general manager Wang Teng previously hinted at the short video platform that REDMI has a new machine to be published this month, and the key word is “small whirlwind”. It is expected to be the REDMI Turbo 4, which will first carry Dimensity 8400.
In addition, the REDMI Turbo 4 will use a 1.5K straight screen, equipped with a large capacity battery, which will be the strongest REDMI Turbo phone, very competitive in the same gear.