Officially Preheating: Redmi K30 Series Uses 6.67-inch 4.38mm Punch Hole Screen

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Redmi K30 series flagship new product launch conference was held on December 10. Earlier today, the official has confirmed that the machine will be equipped with Qualcomm Snapdragon 765G processor for the first time, and now the official preheats the phone again.

Redmi claims that the Redmi K30 series has a 6.67-inch full-screen, and also uses the more mature second-generation digging screen technology, with a 4.38mm aperture and less digging area, which is not only beautiful but also has a larger display area. In design, following the reading habits from left to right, the dual-camera front camera is placed in the upper right corner.

Snapdragon 765G is Qualcomm’s latest generation 5G mobile platform, integrated with X52 Modem, supports SA / NSA 5G dual-mode, and has a downlink peak of 3.7Gbps. At the same time, the fifth-generation Qualcomm AIE artificial intelligence engine is used, with 5TOPS of AI computing power. The “G” in Snapdragon 765G stands for Gaming, which means that Snapdragon 765G will have more powerful graphics computing capabilities.

The currently confirmed Redmi K30 is equipped with: side fingerprint recognition, dual perforated front, rear four cameras, support for 5G dual-mode, built-in 12 groups of antennas, and equipped with Snapdragon 765G processor; breaking news includes: Redmi K30 supports up to 30W fast charge, Redmi K30 Pro is equipped with MediaTek’s latest 5G chip, and supports up to 66W fast charge.

Visit Also: Redmi K30 Pro Appears In Images Showing Its Definitive Design

This conference will also officially launch the Redmi router AC2100, Redmi small love speaker Play, and RedmiBook full-screen notebook.

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