This time, the official disclosed the performance and cooling features of the new machine. Reports indicate that the Redmi K70 Pro will feature a new “ice cooling” system, incorporating a globally planned cooling solution and a new generation of self-developed heat dissipation materials. Additionally, the machine boasts an AI temperature control full-process monitoring function, challenging the limits of passive heat dissipation and witnessing an “epoch-making” comprehensive evolution in heat dissipation technology.
Furthermore, the Redmi K70 Pro is the first batch to integrate the third-generation Snapdragon 8 mobile platform, enhancing AI performance by 98%, and achieving a comprehensive evolution in CPU, GPU, and AI performance. The official slogan is “Pursue full-level performance.”
Yesterday, Blogger @i Bing Universe revealed that the Redmi K70 Pro will depart from 8GB of memory and commence with 12 GB. In comparison to last year’s Redmi K60 Pro model, the starting price for the same memory configuration begins at 3,899 yuan. This suggests a potential adjustment in the starting price of the new machine. Alternatively, there is a possibility that the new machine will increase in quantity without a price hike, maintaining the price range of the previous generation. However, the final details will only be announced at the press conference.
As per another blogger, @DSP-Charles, the Redmi K70 Pro will bid farewell to plastic frames, adopting metal frames along with two other new configurations.
Earlier today, Xiaomi officially declared that the Redmi K70 series launch conference is scheduled for November 29.
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