Igeekphone March 21 news, Huawei P70 series was rumored to be released at the end of March, and then due to various reasons, the internal delay to April release.
From the current multi-party Revelations, the warm-up of the P70 series will be put on the agenda in the near future, and the conference is getting closer.
Blogger Fixed Focus Digital has rendered an image based on the latest data, showing the back design of the P70 series.
As can be seen in the figure, the P70 series back shape is very eye-catching, the design of the three-shot module is unique in the industry, the camera is arranged in a triangle, and there is an independent XMAGE logo in the lower right corner.
The main camera size is huge, and the top will use SONY IMX989 sensor, which is the first time Huawei has used a one-inch sensor, becoming the largest bottom model of Huawei’s mobile phone so far.
It is reported that Huawei’s internal meeting will position the importance of the P70 series over the Mate series and shoulder the heavy responsibility of returning to the image TOP.
In addition to the top model, the P70 is also equipped with a standard 50 million pixel large bottom main camera, latent telephoto lens, and the standard version also has good image strength.
As for the core aspect, the P70 series will remain consistent with the Mate 60, equipped with the Kirin 9000S chip and support 5G.