Today, Xiaomi official has just announced the cooling design of Mi 10, which claims to use an “a bit exaggerated” 3-dimensional cooling system. According to the Xiaomi official: “We have made a whole-body heat dissipation design for Mi 10 which includes a Material sufficient: Super VC, Super graphite and Core flagship graphene the 2nd one is More accurate: Increased from 1 temperature control point to 5 and AI dynamically adjusts thermal design. ”
Recently, the Xiaomi officially released a teaser of the upcoming flagship Phone, which emphasized that Mi 10 is a high-end flagship phone built for dreams and it is a masterpiece of Xiaomi’s 10-year success.”
From the information currently available, the Xiaomi Mi 10 series will be equipped with Snapdragon 865 processor with an LPDDR5 RAM, WiFi 6, UFS 3.0 storage and the main camera with Quad-modules, one of which has a resolution of 108MP. In terms of design, the Xiaomi Mi 10 series are designed with a curved screen with a hole in the upper left corner.
At present, Xiaomi has confirmed that Mi 10 will be released online on February 13 and an appointment is now open. Xiaomi,s new product launch conference starts at 14:00 on February 13th.
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