On the social platform, the blogger Bing Universe recently shared exciting news about the upcoming Xiaomi Mi 14 Pro smartphone, slated to have the slimmest frame of all models in 2023. The display supplier for this device is Huaxing Optoelectronics.
The leaked images reveal that the Xiaomi Mi 14 Pro will feature a cutting-edge flexible screen with a center hole provided by China Star Optoelectronics. The company has implemented a novel circuit structure design, relocating the Fanout wiring inside the display area. This innovative approach effectively eliminates the issue of the original lower frame’s wiring taking up significant space, leading to the achievement of the coveted “narrow chin” design.
Powering the Xiaomi Mi 14 Pro is the Qualcomm Snapdragon 8 Gen3 mobile platform, boasting a remarkable configuration. The chip comprises one super core, five large, and two small cores. Notably, the super core is not Arm’s latest Cortex X4.
It’s important to mention that the Qualcomm Snapdragon 8 Gen3 is built on TSMC’s N4P process, though it did not use the cutting-edge 3nm process from TSMC. Nonetheless, smartphone enthusiasts can look forward to the first batch of Mi 14 Pro devices equipped with the Snapdragon 8 Gen3 mobile platform, set to be unveiled in November.
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