On April 21, Fast Technology published a report revealing that Xiaomi, a renowned smartphone manufacturer, had launched a new product, the Xiaomi 13 Ultra, at a recent product launch conference. However, it seems Xiaomi is not yet done, as a further 5G phone is reportedly in the works. The latest model, which has passed the domestic compulsory product certification, is known as the 23046PNC9C, and it is equipped with a 67W charger, just like its predecessor in the IMEI database. The news is even more exciting as the product manager of Xiaomi Civi, Xin Xin, has also teased a mysterious new phone. Given this context, it’s highly probable that this unannounced phone is none other than Xiaomi Civi 3.
According to earlier reports, Xiaomi Civi 3 will feature a powerful MediaTek Dimensity 8200 chip, significantly more potent than the previous Snapdragon 778G Plus and Snapdragon 7 Gen1. The CPU boasts an 8-core design, 1+3+4 three-cluster architecture, and 4 Cortex-A78 large cores + 4 Cortex-A55 small cores, of which one A78 large core can reach 3.1GHz.
Regarding benchmark scores, Dimensity 8200 AnTuTu has a total score of over 900,000 points, while the Qualcomm Snapdragon 7 Gen1, which powers Civi 2, has a running score of fewer than 600,000 points. This means Xiaomi Civi 3 will likely outperform its predecessor in performance and speed.
Moreover, the upcoming Xiaomi Civi 3 will have an FHD+120Hz high-refresh screen and a front-facing 32-megapixel dual camera. Interestingly, it’s worth noting that the current “pill” digging screen on Xiaomi Civi 2 will remain, and its shape is said to be somewhat similar to the intelligent island of the iPhone 14 Pro.
Finally, it’s worth noting that although Xiaomi has not officially announced the release date for the Xiaomi Civi 3, the product manager’s recent actions suggest that the phone will likely be released soon. It will undoubtedly be exciting to see how Xiaomi’s newest smartphone will perform in the market, particularly given its advanced features and impressive specifications.
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