On July 23rd, iGEEKPHONE reported that the well-known digital blogger @Digital Chat Station disclosed a model equipped with the Dimensity 8500 chip. Judging from the peripheral design and configuration, there is a high probability that it is the successor model of REDMI’s performance phone Turbo4, Turbo5.
According to the leaked information, the new device is expected to be the first to be equipped with Mediatek’s new generation of Dimensity 8500. It is expected that its overall performance will surpass the current Snapdragon 8s Gen4, making it a strong competitor to the new generation of mid-range chips.
In addition, this device will be equipped with a large-capacity battery of over 7000mAh, significantly enhancing its battery life and aligning with the Turbo4 Pro.
In contrast, the REDMI Turbo 4 is equipped with the Mediatek Dimensity 8400 mobile platform and has a built-in 6550mAh large-capacity battery.
In terms of peripheral design, the REDMI Turbo 5 will continue the signature large R-corner screen design of the Turbo4 series, paired with a metal frame and a minimalist Deco design. The overall appearance not only retains the classic elements of the series but also showcases a unique sense of refinement in the details.