Earlier this week a Chinese blog “ITHome” said that Dimensity 9000 will be launched around February – March 2022 and the OPPO flagship smartphone is expected to be the first device to house the latest MediaTek chipset. Indeed, it is said that Oppo is currently working on its next flagship, dubbed the Find X4 Pro. However, the upcoming flagship might be named Oppo Find X5 Pro. This relates to the number 4 which is considered an “unlucky number” in China.
Besides, now the parameters of the Find X5 Pro also have been leaked to the network. According to the network informant Digital Chat Station, the smartphone will offer a 6.7-inch display with a resolution of 3216×1440 pixels with an adaptive refresh rate of 120 Hz thanks to LTPO 2.0 technology.
The rear camera setup of this device will be equipped with a 50MP main camera using a Sony IMX766 sensor and OIS support. It is coupled with a 50MP ultra-wide lens and a 13MP tertiary camera. As for selfies, the X5 Pro’s punch-hole screen will house a 32MP camera with a Sony IMX709 sensor.
For those of you who are curious about the power supply, the OPPO Find X5 Pro will likely carry a 5000mAh battery that supports 80W fast charging and 50W wireless charging. The device will likely run on the latest Android 12 with ColorOS 12 on it.
Previous reports stated that the Snapdragon 8 Gen 1 will power the device along with OPPO’s MariSilicon X chip. However, if the latest leaks are to be believed, the OPPO X5 Pro might ditch the Snapdragon 8 Gen 1 in favor of the upcoming Dimensity 9000 chipset.
The MediaTek Dimensity 9000 SoC adopts the combined TSMC 4nm process + Armv9 architecture and features a high-performance Cortex-X2 super core. The SoC also consists of three Arm Cortex-A710 cores clocked at 2.85GHz and four Arm Cortex-A510 energy-efficient cores. In addition, the Dimensity 9000 supports LPDDR5X memory.
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