Igeekphone reported on June 11th that the blogger Digital Chat Station revealed that the OPPO Find X9 engineering phone is equipped with the Dimensity 9500 platform, features a 1.5K large R-angle straight screen, adopts the LIPO extremely narrow four-sided packaging process, and the lens Deco is not a large circle. One of the undetermined versions is a matrix design in the upper left corner.
Compared with the previous generation Find X8 series, the OPPO Find X9 series has three main changes. First, it fully returns to the straight screen and no longer launches the deep micro-curved screen. Second, the processor has been upgraded to the Dimensity 9500, which is the strongest mobile phone chip from Mediatek. Third, the Deco lens is no longer a centered large circle, and the industrial design will undergo significant changes.
It is revealed that the Dimensity 9500 will debut in September this year, which means that the OPPO Find X9 series will be released as early as September.
In terms of specifications, the Dimensity 9500 is built on TSMC’s N3P process (TSMC’s third-generation 3nm technology), and its CPU has been upgraded to a brand-new full-core architecture, including 1*Travis+3*Alto+4*Gelas, still featuring an 8-core design.
Meanwhile, the Dimensity 9500 integrates the Immortalis-Drage GPU, adopts a brand-new microarchitecture, enhances ray tracing performance while reducing power consumption, and its computing power is expected to reach 100TPOS.
In addition, the screen sizes of the OPPO Find X9 series are 6.59 inches and 6.78 inches respectively, corresponding to the standard version and the Pro version respectively. The two models will be unveiled on the same stage.