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    You are at:Home»Google»Rendering images of the Google Pixel 11 Pro have been released: equipped with the Tensor G6 chip and the MediaTek M90 modem
    Google

    Rendering images of the Google Pixel 11 Pro have been released: equipped with the Tensor G6 chip and the MediaTek M90 modem

    Brady CottonBy Brady CottonApril 1, 2026
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    Igeekphone reported on April 1st: The tech media Android Headline published a blog post yesterday (March 31st). Firstly, it shared the renderings of the standard version and the foldable version. Then, it again released the CAD rendering of the Google Pixel 11 Pro smartphone.

    In terms of appearance, from the leaked renderings, the new device has adjusted the camera module on the back. Although the overall shape retains the iconic elliptical outline of the previous generation, Google has removed the original color-mixed parts. Instead, a single piece of dark glass is used to completely cover the entire lens area.

    In terms of dimensions, the source disclosed that the Pixel 11 Pro measures 152.7 x 71.8 x 8.4 millimeters, which is basically the same as the Pixel 10 Pro (152.8 x 72 x 8.6 mm), being 0.1 millimeters shorter, 0.2 millimeters narrower, and 0.2 millimeters thinner.

    The front of the device retains the 6.3-inch OLED display. In terms of core performance, the Pixel 11 Pro will be equipped with Google’s newly developed Tensor G6 system-level chip, estimated to adopt a 7-core configuration. Additionally, it is reported that Google has abandoned its original baseband solution and instead integrated the M90 modem provided by MediaTek.

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