On July 7th, iGEEKPHONE reported that blogger “Referline” exposed a spy photo of the back cover of a mobile phone today, which is suspected to be Xiaomi’s next-generation digital flagship – the Xiaomi 16 series.
It can be seen that the most prominent feature on its back is the adoption of an extremely large horizontal matrix module, which is exactly the same as the iPhone 17 Pro that was leaked.
Of course, this is not that Xiaomi has copied the iPhone in advance. As early as on the Xiaomi 11 Ultra, Xiaomi had used such a super-large module and even added a secondary screen on the right side.
Judging from the current space requirements for mobile phone camera modules and batteries, it is certain that no secondary screen will be added to the Xiaomi 16 series.
It should be noted that the flash, laser autofocus and Leica logo of this new model have all been moved to the bottom of the module and arranged separately. This might be because the lens module is relatively large in size this time.
From this perspective, this back panel should be from the Xiaomi 16 Pro model, or even the Xiaomi 16 Ultra. The standard version won’t be so equipped with imaging modules.
According to leaks, the Xiaomi 16 series will be among the first to be equipped with the Snapdragon 8 Elite 2, rather than Xiaomi’s self-developed Xuanjie chip.
For some time to come, the Snapdragon is likely to remain the main chip for Xiaomi’s flagship models, while the Xuanjie chip will be an exclusive configuration for specific models such as the Xiaomi S series phones and Ultra tablets.
The Qualcomm Snapdragon Summit 2025 will be held from September 23rd to 25th. At that time, the Snapdragon 8 Elite 2 will make its official debut. It is expected that the first model to be launched will be unveiled as early as September, and the Xiaomi 16 series is likely to be launched again.