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    You are at:Home»NEWS»Xiaomi 18 Ultra Mystic Ring Edition leaks out: Global debut of Mystic Ring O3 – Xiaomi’s strongest super-large model
    NEWS

    Xiaomi 18 Ultra Mystic Ring Edition leaks out: Global debut of Mystic Ring O3 – Xiaomi’s strongest super-large model

    Brady CottonBy Brady CottonMay 6, 2026
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    Igeekphone News reported on May 6th that last May, Xiaomi launched its annual flagship device, the Xiaomi 15S Pro. This device was a derivative of the Xiaomi 15 Pro and was the first to feature the Xiangji O1 chip. This was Xiaomi’s most powerful mobile chip developed independently, marking that Xiaomi became the first enterprise in China and the fourth in the world to be able to independently design 3nm mobile chips.

    The birth of the Xuanji O1 not only demonstrates Xiaomi’s research and development capabilities in the field of top-notch chips, but also fills the gap in the domestic market for high-performance 3-nanometer mobile processors. One year later, news about Xiaomi’s next self-developed chip has once again attracted attention. The more powerful Xuanji O3 is already on the way.

    According to a relevant blogger’s revelation, Xiaomi is secretly developing an Ultra model equipped with the Xuanji O3 chip. This device might be the future Xiaomi 18 Ultra. This chip was designed with the aim of achieving the ultimate performance, aiming to further solidify Xiaomi’s leading position in the high-end flagship market.

    The revelations indicate that the Xuanji O3 still adopts an advanced 10-core architecture design, with its internal code name being Lhasa. This chip is manufactured using TSMC’s 3nm process technology. Its CPU part consists of 2 large Cortex-X925 cores, 2 ultra-high-frequency Cortex-A725 cores, 4 high-frequency Cortex-A725 cores, and 2 Cortex-A520 small cores.

    This extremely complex core combination means that the performance of Xuanji O3 will reach new heights. It is worth noting that the application scope of this chip will no longer be limited to smartphones. In the future, it will be widely installed on various intelligent terminal devices under Xiaomi’s brand, achieving self-developed chip coverage throughout the entire ecosystem.

    This cross-category application layout will further expand the ecological application scenarios of self-developed chips. Through deep collaboration at the underlying hardware level, Xiaomi can more effectively enhance the intelligent experience of full-scene interconnection, and create a smoother and more intelligent digital life loop for users.

    With the arrival of Xuanji O3, it is evident that Xiaomi has continued to make breakthroughs in the semiconductor industry chain. This not only significantly enhances Xiaomi’s own core competitiveness, but also will strongly promote the overall development of the domestic semiconductor supply chain, demonstrating the determination of domestic brands to deeply engage in core technology fields.

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