Igeekphone News, July 20th: Recently, digital blogger “Dingjiao Digital” revealed that the Honor Mini Foldable is expected to start preheating next week. It will be a square mini foldable and its appearance can be similar to that of Samsung.
In line with the brand naming rules, the new model will be HONOR Magic V Flip2, tentatively scheduled for release in August.
According to the digital blogger “Digital Chat Station”, the HONOR Magic V Flip2 will be the small foldable with the largest battery this year, with a maximum battery capacity of 5500mAh± and support for up to 80W fast charging.
The new model has not undergone significant changes in form. It features a 6.8-inch LTPO main screen and a 4-inch LTPO high refresh rate secondary screen.
In terms of core performance, the HONOR Magic V Flip2 will be equipped with the Snapdragon 8 series sub-flagship chip, which is expected to be the fourth-generation Snapdragon 8s.
The fourth-generation Snapdragon 8s is fabricated using TSMC’s 4nm process, with a CPU configuration of 1*3.21GHz X4+3*3.01GHz A720+2*2.80GHz A720+2*2.02GHz A720.
The GPU adopts the Adreno 825 of the same generation as the Snapdragon 8 Ultra Adreno 830, and the overall performance of the chip is comparable to that of the third-generation Snapdragon 8.