Igeekphone reported on June 4th that Jeff Pu, an analyst of Apple’s supply chain, said in a report that the iPhone 18 Pro series and foldable screen models (temporarily called iPhone 18 Fold) will be equipped with the significantly upgraded A20 chip. This processor not only achieves new breakthroughs in manufacturing technology, but also brings key architectural innovations.
Specifically, the Apple A20 chip will be the first to adopt TSMC’s 2-nanometer process, achieving a generational leap compared to the second-generation 3-nanometer (N3E) adopted by the iPhone 16 Pro and the third-generation 3-nanometer (N3P) adopted by the iPhone 17 Pro. Moreover, the transistor density of the 2-nanometer process has been further enhanced, and it is expected that the performance will be 15% higher than that of the A19. The energy efficiency ratio has increased by 30%.
Jeff Pu also pointed out that in addition to the 2-nanometer process, the A20 chip will also adopt TSMC’s new-generation wafer-level multi-chip packaging technology (WMCM), which will bring about three major innovations:
The first is the innovation of memory architecture: RAM will be directly integrated with the CPU/GPU/ neural network engine on the same wafer, replacing the existing separated design; Second, the performance has been improved, and the heat dissipation efficiency has increased by 20%, with the battery life extended by 10-15%. Thirdly, the chip packaging area has been reduced by 15%, making more space available for other components inside the iPhone.
Based on various information, the iPhone 18 Pro series and foldable screen models released in September 2026, with the A20 chip, not only have a significant upgrade in performance, but also have obvious progress in aspects such as heat dissipation and AI, which is worth looking forward to.