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    IGeeKphone China Phone, Tablet PC, VR, RC Drone News, Reviews
    You are at:Home»NEWS»Mediatek Dimensity 9300 chip and vivo X100 series mobile phones will be released in November
    NEWS

    Mediatek Dimensity 9300 chip and vivo X100 series mobile phones will be released in November

    Brady CottonBy Brady CottonOctober 8, 2023
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    Igeekphone October 8 news, according to Wall Street, vivo X100 series will be released in November, the machine will be the first Mediatek Dimensity 9300 flagship chip. The news was also confirmed by digital blogger @Fay.

    According to the current known information, the first batch of vivo X100 series only X100 and X100 Pro two models, the first Mediatek Dimensity 9300 mobile processing platform; The X100 Pro+ is scheduled to be released after the Spring Festival, equipped with Qualcomm Snapdragon 8 Gen 3 platform.

    In addition, there is news that Mediatek will launch Dimensity 9300 in the 45th week (October 30 – November 5), that is, two weeks later than the Qualcomm Snapdragon 8 Gen 3.

    Earlier, Mediatek officially confirmed that the next generation of the Teguet 9300 platform will use Arm’s latest Cortex-X4 ultra-large core and Cortex-A720 large core, and the new energy-efficient microarchitecture based on the same process can reduce power consumption by up to 40%.

    According to the news of the digital blogger @Digital Chat station, the prototype frequency is 3.25GHz ±, the CPU is designed with 1*X4+3*X4+4*A720, and the GPU is Immortalis G720 MC12. Igeekphone notes that this is the first time Mediatek has adopted a full-core architecture design, with four Cortex-X4 super-large cores, which increase performance by 15% and reduce power consumption by 40% compared to X3.

    In addition, @digital chat station also revealed that Dimensity 9300 runs more than Qualcomm Snapdragon 8 Gen 3 in Antutu V10, of which the GPU is higher and the CPU is much higher. However, the energy consumption performance of Tianguet 9300, the blogger did not disclose.

    It is worth mentioning that the Dimensity 9300 is based on TSMC’s N4P process, which is a process further optimized by TSMC on the basis of 5nm. TSMC claims that the N4P process can improve performance by 11 percent compared to the original N5 process, or improve energy efficiency by 22 percent and transistor density by 6 percent, while N4 can improve performance by 6.6 percent.

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