In the Tech Summit event which was held from November 30 to December 2, Qualcomm was said to be introducing a flagship mobile chipset. Tech Summit is usually the debut of Qualcomm’s newest premium chipset. Therefore, at this year’s event, Qualcomm will most likely introduce Snapdragon 898 as the successor to Snapdragon 888.
However, the exact details of the debut were still unknown so far. Today, the infamous Chinese tipster, DigitalChatStation, revealed that the Qualcomm Snapdragon 898 will be launched by the end of this month. According to the leakster, the company will announce the new flagship chipset this month and we can expect phones powered by the aforementioned SoC to launch later.
The whistleblower said several new devices have leaked onto the internet in various online certification portals and revealed that the sm8450 (nicknamed Snapdragon 898) having Samsung’s 4nm build process will be launched this year and the sm8475 – possibly called Snapdragon 898+ – will be released in mid-2022.
The Qualcomm Snapdragon 898 is expected to have a main AMR Cortex-X2 CPU core – running at 3.0 GHz, alongside three Cortex-A710-based center cores clocked at 2.5 GHz and finally four efficient Cortex-A510 derivative cores at 1.79 GHz.
The GPU is referred to as the Adreno 730, with an architectural upgrade over the Adreno 660 and Samsung’s 4nm manufacturing process possibly bringing a performance increase of up to 20%. For connectivity, the X65 5G modem is expected, with a theoretical maximum downlink speed of 10Gbps.
Interestingly, many mobile phone OEMs will soon launch phones with the aforementioned Snapdragon 898 SoC. The first group of companies includes Xiaomi, Huawei, Lenovo, Motorola, Vivo, Oppo, and the Korean giant Samsung.
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