Igeekphone News July 7 – A new leak has offered what may be the clearest look yet at Apple’s next-generation iPhone 18 Pro hardware, revealing alleged logic board images that provide fresh details about the upcoming A20 Pro processor and its internal design.
The images were shared on X by tech source @TECHINFOSOCIALS, who posted three high-resolution photos said to show the logic boards of the iPhone 18 Pro and iPhone 18 Pro Max.
The latest leak expands on previous reports from June, offering a closer look at Apple’s rumored A20 Pro chipset, memory configuration, and cellular modem integration.
A20 Pro Expected to Be Apple’s First 2nm Chip
According to the leaked information, the A20 Pro is expected to become Apple’s first processor manufactured using a 2nm process, marking a significant step forward in performance and power efficiency.
Although the chip package is reportedly similar in size to the current-generation A19 Pro, the silicon die itself is said to be larger, suggesting increased transistor density and additional processing capabilities.
New Packaging Design for Improved Cooling
One of the most notable changes involves the chip’s internal packaging.
The leak claims Apple has relocated the DRAM memory to the side of the A20 Pro processor rather than stacking it directly above the chip. The new layout reportedly uses Wafer-Level Multi-Chip Module (WMCM) packaging, a design intended to improve heat dissipation while maintaining a compact footprint.
Better thermal performance could help sustain peak CPU and GPU performance during demanding workloads such as gaming, AI processing, and professional video editing.
LPDDR6 Memory Could Improve Performance and Efficiency
The leaked logic board also appears to confirm earlier reports that the A20 Pro will be paired with 96-bit LPDDR6 memory.
Compared with LPDDR5X, LPDDR6 is expected to deliver higher memory bandwidth alongside improved power efficiency. The upgrade could benefit AI workloads, multitasking, graphics performance, and overall system responsiveness while also contributing to longer battery life.
Qualcomm Modem Still Expected for U.S. Models
The images also show a component labeled PMX75, which aligns with previous reports suggesting that Apple will continue using a Qualcomm cellular modem for at least some versions of the iPhone 18 Pro lineup.
Industry observers believe the label refers to Qualcomm’s next-generation Snapdragon modem, likely to be used in the U.S. versions of the iPhone 18 Pro and iPhone 18 Pro Max.
Apple has been working toward developing its own in-house modem technology, but reports indicate the company is expected to continue relying on Qualcomm for certain flagship models during the transition period.
Still an Early Leak
As with all pre-release information, the leaked images and specifications remain unconfirmed, and Apple has not commented on their authenticity.
However, if accurate, the leak suggests the iPhone 18 Pro series could introduce meaningful hardware improvements, including Apple’s first 2nm chipset, next-generation LPDDR6 memory, enhanced thermal design, and continued high-performance cellular connectivity, making it one of the company’s most significant internal upgrades in recent years.