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    You are at:Home»NEWS»MediaTek Dimensity 1200 and Dimensity 1100 5G SoCs Unveiled
    NEWS

    MediaTek Dimensity 1200 and Dimensity 1100 5G SoCs Unveiled

    Farrukh AhmadBy Farrukh AhmadJanuary 20, 2021
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    With the Dimensity 1200 and 1100, Mediatek brings two SoCs (System-on-a-Chip), which are designed for premium smartphones and manufactured in a 6-nanometer process and also have 5G connectivity on board. The larger Dimensity 1200 differs from the slightly smaller 1100 in terms of performance mainly in two factors that affect several performance areas.

    The MediaTek Dimensity 1200 uses one of them as the so-called Ultra Core in its four-man combination made of ARM Cortex-A78. This single core can achieve a performance of up to three GHz and has double the L2 cache. Mediatek made the ARM Mali-G77 MC9 graphics unit at 1200 legs. This is at least suggested by the addition “Boosted”, which the otherwise identical GPU of 1100 does not have.

    In fact, the Dimensity 1200 can control screens with FHD Plus resolution with up to 168 Hertz, the smaller brother only with up to 144 Hertz. If it goes beyond Full HD, both Dimensity chips are only capable of 90 Hertz. There is a small difference in the image processor: Here 1200 can control cameras with up to 200MP, the smaller 1100 supports the only 108MP. Likewise, only 1200 can record 4K videos with a high dynamic range.

    Dimensity 1100 and 1200 Otherwise Identical

    The 1200 and 1100 do not differ in any other respect. In terms of performance, they should be a little below the new Qualcomm Snapdragon 888, but well within the range of what is required for current premium smartphones. The Dimensity 1200 should be a bit more powerful than the Dimensity 1100 in all points due to the higher clock rates.

    The new Dimensity chips come with four ARM Cortex-A78 and four ARM Cortex-A55 each. The older version Mali-G77 is used as the graphics unit. For the main memory, Mediatek still uses LPDDR4X with 2,133 Mhz. Unlike the competition, Mediatek does not use the Cortex-X1.

    5G is integrated directly in the SoC of both Dimensity 1200 and 1100 chips, which should ensure higher data throughput. Bluetooth version 5.2 and Wi-Fi 6 are also on board. The chips allow dual 5G in dual SIM smartphones. The first smartphones with the new chips, for example from Xiaomi, Oppo, Realme, and Vivo, should be in stores by the end of March or the beginning of April.

    Read Also: Xiaomi MIJIA Smart Camera AI Exploration Edition Launched For $61

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