Vivo officially announced today that the new generation of flagship mobile phone Vivo X90 series and Hi-Fi wireless headset Vivo TWS 3 series will be released at 19:00 on November 22, please stay tuned.
As previously revealed, the new vivo X90 series will consist of three versions, the X90, X90 Pro and X90 Pro +, which will be powered by Dimensity 9200, Dimensity 9200 and Snapdragon 8 Gen2 flagship platforms respectively. It is worth mentioning that Vivo X90 series will be the world premiere of Dimensity 9200 chip.
Another big new product, Vivo TWS 3 series headphones, boasts a new generation of LE Audio Bluetooth audio technology, Bluetooth 5.3 support, the industry’s first full-link wireless true Hi-Fi, intelligent ultra-broadband noise reduction, non-sensitive temperature monitoring, LC3 game low latency, multi-device dual connection and so on.
According to the previous warm-up, the vivo TWS 3 series headphone transmission bit rate up to 1.2Mbps, equipped with high-performance DAC chip, will also be equipped with 40kHz and above ultra broadband high frequency list.
According to the latest run score posted by vivo product manager Han Boxiao, the vivo X90 with Dimensity 9200 scored 1,284,467 points.
Igeekphone understands that the chip is built based on the 4nm process of TSMC, and its CPU part adopts the eight-core architecture of “1+3+4”, which is composed of 1*3.05GHz X3+3*2.85GHz A715+4*2.0GHz A510. The GPU is Immortalis-G715 MC11, and it is also the first Arm GPU to support hardware ray tracing, which can bring more real and immersive light and shadow picture effect.