Huawei Honor 9 Spotted at TENAA as Xiaomi MI6 Killer


Previously, we reported that Huawei Honor 9 will be officially released on June 27 in Berlin in Germany, and Huawei Honor 9 Chinese edition will be released on June 20. Right now this smartphone has spotted at TENAA, and its specs and design have been unveiled.

There are three models spotted at TENAA, they are STF-TL10, STF-AL00 and STF-AL10, as for design, they are same with dual SIM card, dual standby and netcom function, only different in internal storage.

In design, they are same as previous leaked photos, such as dual rear camera, dual glass panel, it looks like Xiaomi MI6 a little, but we have seen this kind of design on Huawei Honor 8. Currently, dual glass panel seems become tendency after metal body design.

As for specs, Huawei Honor 9 is powered by Octa core 2.4GHz processor, it should be Kirin 960 processor, coming with RAM 4GB/6GB ROM 64GB internal storage, but we haven’t seen ROM 128GB until now.

In camera, it has dual rear camera, 12MP and 20MP, it may be the dual rear camera of Huawei Honor 9, and it will still use black+white and color dual rear camera, it will also have 8MP front camera.  About its design, it will have 5.15 inch FHD screen with 1920×1080 resolution, built in 3,100mAh battery, running Android7.0 OS.  It has 147.3×70.9×7.45(mm) dimensions, 155g weight. It will have golden color. But in terms of specs, it will be the rival of Xiaomi MI6, in addition, this smartphone will have a 3.5mm earphone jack compared with others, it will come out on June 20, stay tuned.




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