Although the Mate 20 ends, practically, to see the light, Huawei is already thinking about its next high-end phones of 2019, the Mate 30. A few weeks before the Mobile World Congress, and the presentation of the Huawei P30, either at MWC 2019 or outside it, new leaks and rumors about the company’s next phones arrive. And there is great news for enthusiasts of pure and hard technology since the Huawei Mate 30 motherboard will be a breakthrough.
According to the source, Huawei has chosen the SLP technology for the motherboards of the flagship Mate 30 smartphones. Switching to SLP will allow engineers to place larger capacity batteries and multi-module cameras inside the case.
SLP (Substrate Like PCB) technology implies a rather dense arrangement when the elements are located either close to each other, or combined into modules. Due to this approach, the motherboard is very compact, inside the case there is more free space for different components. First of all, it can be used for the battery and camera – the most important components of a modern smartphone. Also, the SLP PCB has more layers – 20, which is approximately two times more than that of a regular smartphone PCB.
SLP technology is already used in Samsung Galaxy S9 based on Exynos SoC, as well as Apple in iPhone models (for example, in the same iPhone X), and now Huawei plans to use it. It is expected that the SLP technology will be used in smartphones Samsung Galaxy S10, but, again, only in models of SoC Exynos.
Many details about the Huawei Mate 30 are still unknown, but it is said that they will have 5 Photosensors. This is one of the reasons why Huawei needs to use SLP boards because a camera of this type involves a large space inside the terminal.
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