Igeekphone News, May 22: A digital blogger posted a set of custom phone cases for iPhone 18, iPhone 18 Pro, and iPhone 18 Pro Max on social media. The detailed appearance designs of these several new devices were thus revealed in advance.
Based on the matching effect of the released phone cases, the standard version of iPhone 18 still retains the vertical dual-camera module design of the previous generation. It has two rear cameras and the overall shape of the back of the phone has not changed much, maintaining the consistent design continuity of Apple’s standard model.
The iPhone 18 Pro and iPhone 18 Pro Max retain the highly recognizable horizontal large matrix DECO design. The entire device will feature an aluminum body, and a highly distinctive dark red color will also be added.
Compared with the previous iPhone 17 series, the most notable change in the iPhone 18 series is not the adjustment of the appearance, but the significant adjustment in the release schedule of the entire product line, which completely breaks the regular release pattern of Apple in previous years.
It is reported that at the Apple event in the autumn of 2026, three high-end flagship models will be launched first. They are iPhone 18 Pro, iPhone 18 Pro Max, and the first foldable screen model that has long been anticipated by Apple fans – iPhone Fold.
The more affordable iPhone 18 standard edition, which is targeted at the mainstream consumer market, will be released later in the spring of 2027. The release of these two products will be spaced approximately six months apart.
In terms of hardware configuration, the iPhone 18 series will debut two brand-new self-developed chips – the A20 chip and the A20 Pro chip. Among them, the standard version of iPhone 18 will debut the A20 chip, while the iPhone 18 Pro series and iPhone Fold will be equipped with the more powerful A20 Pro chip with enhanced performance.
These two new chips both adopt the most advanced 2nm manufacturing process of TSMC. They have achieved dual breakthroughs in computing performance and battery efficiency. Moreover, the packaging technology of the chips will completely switch from the InFO process that Apple has used for many years to the more advanced WMCM process, which will further reduce the heat and power consumption of the chips and enhance the stability of the entire device.