Igeekphone News, May 21st: Qualcomm’s next Snapdragon Summit has been officially announced to be held on September 23rd, and Xiaomi has also announced that it will once again be one of the first manufacturers to adopt the next-generation flagship Snapdragon 8 series chips this year.
The new generation of Xiaomi 16 is expected to be released as early as September and is likely to be equipped with either the Xuanjie or Snapdragon chip. Majinbu Official released a CAD rendering of the Xiaomi 16 yesterday, showing the early design plan of this model.
The Xiaomi 16 has been confirmed to adopt a compact body design, presenting a typical minimalist aesthetic. It is expected that the display size will be between 6.32 and 6.36 inches.
The renderings show that this model will adopt the family-style rectangular rear camera DECO design, equipped with a triangular-arranged triple-camera module (including a periscope telephoto lens, continuing the Leica collaboration), and come with an LED flash and an additional sensor, which is slightly protruding compared to the body.
In addition, its back will adopt a completely flat body supplemented by 2.5D slightly curved borders. There are independent volume keys on the right side. The USB-C interface, speaker and SIM card slot are retained at the bottom.
Expected configuration of Majinbu Official:
Processor: Equipped with Qualcomm Snapdragon 8 Elite 2, the performance of GPU and CPU has increased by 30% and 25% respectively compared to the previous generation
Imaging: 50MP triple camera setup, including a periscope telephoto lens, continuing the Leica imaging collaboration
Battery life: 6800mAh battery, supporting 100W wired fast charging
System: Pre-installed HyperOS 3.0 system
Others: IP69 water and dust resistance certification and metal frame structure
Price: The predicted selling price may exceed 700 US dollars (IT Home Note: The current exchange rate is approximately 5,054 RMB)