On November 4th, Igeekphone reported that the blogger Digital Chat Station revealed that the Qualcomm Snapdragon 8 Elite Gen6 (hereinafter referred to as Snapdragon 8E6) series has two options: the standard version and the Pro version. Both are manufactured based on TSMC’s N2P process (2nm). The GPU specifications of the two versions are different. It is expected that only the Pro version supports LPDDR6 memory.
Compared with the Snapdragon 8E5, the CPU architecture of the Snapdragon 8E6 has been adjusted from the original 2+6 design to a 2+3+3 design. The blogger also revealed that the cost of the Snapdragon 8E6 has skyrocketed. The combination of UFS 5.0 flash memory, LPDDR6 memory and 2nm Snapdragon 8E6 has increased by another 500 yuan.
Recently, the prices of storage products have shown an astonishing upward trend. TrendForce data shows that DRAM prices rose by 171.8% in the third quarter of 2025 compared with the same period last year.
Looking ahead to next year, memory prices are expected to remain at a high level. Moreover, as the Snapdragon 8E6 chip adopts the brand-new TSMC 2nm process technology, its kit price will rise again. It is anticipated that the prices of related terminals will also experience a price increase.
As is customary, the Snapdragon 8E6 series chips will make their debut in September next year and are expected to be first equipped on the Xiaomi 18 series.