Huawei P50 Could be Launch With Third-Party 5nm Chipset In March 2021


HUAWEI’s next flagship phone the Huawei P50 is officially reported to be the next flagship of 2021. But, the company might not be able to use the HiSilicon chipset due to the licensing issue face from the United State. So it may use a third-party 5nm processing next year. And today, one of the Chinese insiders “Mobile Chip Expert” shared the interesting news about it on the Weibo social network.

According to the informer, the Huawei P50 will be released in March next year – as expected. The development of smartphones of the line is on schedule, along with high-quality cameras, they will receive a new platform, made according to the 5 nm manufacturing process. But it will not be Kirin’s own SoC, but a third-party solution.

What kind of developer is behind this decision – one can only guess, however, given the close relationship between Huawei and MediaTek, so we can assume that the Huawei P50 and P50 Pro will become the first flagships of the company on the new top-end SoC MediaTek – it will be produced according to the 5 nm process technology. According to rumors, the platform will be called Dimensity 2000. Therefore, for P50, an alternative option in the person of Dimensity 2000 can be chosen.

By now, the technical scheme of the Huawei P50 series is ready and it should be in the development stage and will be releasing in March next year according to the usual timeline from Wang Yonggang, general manager of Huawei’s P series products. Aside from the chipset, this smartphone will be focusing on the camera and its aesthetic design.

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