The Samsung Galaxy S23 component supply chain has emerged. Samsung is replacing one of its existing HDI PCB (high-density interconnect printed circuit board) suppliers due to an acquisition outside its control, the report said.
Samsung and Ibiden, a Japanese HDI board supplier, have been cooperating for many years. Ibiden supplied HDI components for multiple generations of Samsung’s Galaxy S series; however, Ibiden’s HDI factory in Beijing was reportedly acquired by a different company planning to produce other types of components, meaning its HDI-based cooperation with Samsung has come to an end.
The Japanese company will no longer supply HDI boards for the Galaxy S series and has hinted at the Galaxy S23 series. Samsung has signed another agreement to obtain HDI boards from another supplier.
Although Ibiden withdrew from Samsung’s HDI board supply chain due to the acquisition, it is reported that Samsung will transfer HDI orders to its other Japanese board supplier, Meiko.
The latter has also been Samsung’s printed circuit board supplier, so it is not a new member of Samsung’s supply chain. However, with the exit of Ibiden, Meiko is expected to receive more HDI board orders from Samsung for the Galaxy S23 series.
The Samsung Galaxy S23 series is expected to be released in January or February 2023, and Samsung has already started developing firmware for the upcoming flagship. Additionally, the 2023 model will be fully powered by a Qualcomm Snapdragon 8 Gen 2 chip. Rumor has it that the Samsung Galaxy S23 series will benefit from an exclusive SoC model highly optimized for the One UI experience.
The Samsung Galaxy S23 series is expected to be equipped with a stronger camera system. Samsung will adjust the supply chain to ensure that the new machine will not be affected and the experience will be guaranteed.