The Digital leaker reveals the renderings and details of the upcoming Xiaomi Mi 13 Standard Edition phone. The design of the Mi 13 will be similar to the iPhone 14, eliminating the curved display on the Mi 12 and replacing it with a completely flat 6.2-inch display with a centered punch hole and a built-in selfie camera.
In addition, the design of the aluminum sides is similar to that of the iPhone 14, even the subtle horizontal lines of the antenna strap. Xiaomi first hinted at this new design direction with the Mi 12 Lite, which was released in early July.
On the rear, the camera bump shares the same design language as the Mi 12, albeit closer to a square rather than a long rectangle. The back will feature a triple-camera system. Unlike the sharp bezels on the front, the Mi 13 will have smooth curved edges on the back.
The body size of the Xiaomi Mi 13 is 152.8 x 71.5 x 8.3mm (including a thickness of 10.3mm when the rear camera is raised).
It is reported that the Xiaomi Mi 13 will use the Qualcomm Snapdragon 8 Gen 2 chip, and like the Xiaomi Mi 13 Pro, it is expected to be unveiled at the November conference.
In terms of imaging, the rear main camera of the new Mi 13 will be a Sony IMX8 series sensor that supports OIS optical image stabilization, rather than the IMX707 of the Mi 12S. Its overall performance is between the Sony IMX707 and the Sony IMX766, and the sensor size is expected to be 1/1.5. inches or so. In addition, the machine will be supplemented by a 50-megapixel ultra-wide-angle lens and a 50-megapixel portrait lens.