CEO Lei Jun Posted The News Of Redmi Pro’s Release, Some Specs And Real Pictures Leaked


Xiaomi’s Redmi Pro flagship smartphone had been speculated all along to be among the devices launching on July 27. But confirmation about that has not been officially done by the Chinese company except via teasers in the form of video or images laced with coded messages, leaving it at the mercy of our brains to interpret the messages.


However just this morning, CEO Lei Jun took to Weibo to express his excitement over the Redmi Pro’s release and categorically confirmed that the flagship device would be released next Wednesday. The message ended there but we were able to gather that he was talking about the Xiaomi news conference holding next Wednesday being July 27.

All along, for the past three days, the three spokespersons for Xiaomi Wu Xiubo, Lu Shi and Liu Hao Ran have taken turns to release promotional videos. The first day, we got served “OLED PING” by Wu Xuibo, followed by Lui Shi who served us “ten nuclear double stem head”, and “Mentor” Liu Hao is going to make “brushed gold potato” (literal translations from Chinese).


The theme of the celebrity cooking highlighted some of the specifications the Redmi Pro will feature. When summed up, the three promotional videos revealed Xiaomi’s next flagship will come with an OLED screen (first for Xiaomi), Deca-core processor + dual camera, and sporting a polished (brushed) metal body.

And here we got 2 leaked images of Redmi Pro with it’s package from Chinese Mi fan.



Xiaomi Redmi Pro Finally confirmed and all set for a July 27 Release

It is rumored that the Redmi Pro will feature a 5.5-inch 1080pixel OLED display and would be powered by a Deca-core MediaTek Helio X25 chipset, alongside 4GB of RAM and a maximum 128GB of onboard storage. The sleek dual-SIM device is said to boot Android 6.0 Marshmallow-based MIUI and would have support for all three networks in China. Also, the device is expected to pop carrying a price tag of around 1499 yuan ($225).


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