Launched in 2015, LeEco Super phone instantly occupied the mobile phone market with extremely high cost performance and created a new record of the fastest sales volume of a new mobile phone brand breaking ten million.
At the end of May, LeEco launched a new LeEco Y1 Pro, with the slogan “Refuse excessive performance, let users pay only for the core value” causing a hot debate among the public.
According to official renderings, leEco Y1 Pro features an iPhone 13-like shape, with a bangs screen on the front, a very narrow bezel, a right angle design in the middle, and a dual diagonal rear camera that looks like an iPhone 13 from a distance.
Today, a digital blogger posted a photo of the real LeEco Y1 Pro. It can be seen from the picture that the phone is greatly different from the rendering picture, with a wider frame on both sides and a wider chin at the bottom. It can be seen as the COP packaging process in the rendering picture, while the real one is the COG packaging process.
Leeco Y1 Pro focuses on the low-end market, and is equipped with TSMC’s domestic chip Huben T310, which uses a 1× 2.0ghz Cortex-A75+3× 1.8ghz Cortex-A55 quad-core CPU architecture and an 800MHz IMG GE8300 GPU. With a running score of 108,000 points, its comprehensive performance is basically at the same level as that of the 2016 Snapdragon 625.
In other configurations, LeEco Y1 Pro uses a 6.5-inch LCD fringe screen with a resolution of 1560×720, a rear 8-megapixel single camera and a front-facing 5-megapixel camera. It is equipped with a 4000mAh battery +10W wired charging, and an advanced 3.5mm headphone jack.
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Leeco Y1 Pro is available in 4GB+32GB, 4GB+128GB and 4GB+256GB storage versions, priced at 499 yuan, 699 yuan and 899 yuan respectively.