On April 29th, Igeekphone reported that the early engineering model of OPPO Find X9 Pro is equipped with the Mediatek Dimensity 9500 platform and features a triple rear camera setup, including a main camera, an ultra-wide-angle lens, and a 200-megapixel periscope telephoto lens.
Compared with the Find X8 Pro, the biggest change in the OPPO Find X9 Pro is the imaging part. The former has a quad-camera dual periscope telephoto lens, including a 50-megapixel 3X periscope lens and a 50-megapixel 6X periscope telephoto lens, while the next-generation flagship Find X9 Pro has been adjusted to a 200-megapixel single periscope lens. This 200-megapixel telephoto lens features an ultra-large 1/1.4-inch sensor and is the largest periscope lens in OPPO’s history.
In addition, the first batch of OPPO Find X9 Pro is equipped with the Mediatek Dimensity 9500 platform. This chip will be built based on the TSMC N3P process technology and adopt a brand-new all-large-core architecture. The CPU includes 1*Travis+3*Alto+4*Gelas. Among them, Travis and Alto are the latest super-large cores of Arm’s Cortex-X9 series, and Gelas is the large core of Arm’s Cortex-A7 series.
In addition, the Dimensity 9500 will integrate a brand-new microarchitecture Immortalis Drage GPU to enhance ray tracing performance and reduce power consumption. It features 16MB of L3 cache and 10MB of SLC cache, making it Mediatek’s most powerful mobile chip.