Following the predecessor Snapdragon 7 Gen 1 and Dimensity 8100, Qualcomm and MediaTek are actively designing two new processors to compete with each other and gain market share in the smart device market. Both these chips use TSMC’s 4 nm process.
According to leaker Digital Chat Station, both MediaTek and Qualcomm are producing two processors named Dimensity 8200 and Snapdragon 7+ Gen 1 or Snapdragon 7 Gen 2 respectively.
With MediaTek, it is having a pretty successful business period because the Dimensity 8100 chip has proven its excellent performance with price. Specifically, the power is on par with Snapdragon 888, but the price is much more affordable, not to mention using the new process.
As for Qualcomm, its next chip could be Snapdragon 7+ Gen 1 or Snapdragon 7 Gen 2, skipping Samsung’s 4 nm process and using TSMC’s process.
Digital Chat Station believes that both chips are in production, there are a few devices that have been leaked to be equipped with these two chips, with large screen refresh rates as well as 100 W charging speeds and 50MP main cameras.
It is not clear when the Qualcomm chipset will launch but it is likely to launch alongside the Snapdragon 8 Gen 2 in November this year. The successor to the Dimensity 8100 is also expected to launch later this year. Promising to be a thrilling confrontation in the high-end mid-range segment this year.