This year’s mobile SoC processors, whether Qualcomm, Huawei, MediaTek, or Samsung, have more and more products, and their product lines have become more and more complex. It was reported on the Internet today that Qualcomm is planning a sub-flagship 5G chip belonging to the Snapdragon 800 series family to fill the gap between the Snapdragon 800 series and the Snapdragon 700 series, and better respond to the Huawei Kirin 800 series and Dimensity 800 series. And other competing products.
As for the specific product, it is said that the tentative name is Snapdragon 860, which is a slightly simplified version of Snapdragon 865, and of course, Snapdragon 860 is also an external 5G baseband.
In the next generation, Qualcomm is expected to launch a new flagship at the end of the year, named Snapdragon 875G, for the first time to integrate 5G baseband on the flagship platform, and it will also have a streamlined version, which may be called Snapdragon 875 Lite.
According to the previously exposed roadmap, Qualcomm will commercialize Snapdragon 662 and Snapdragon 460 in the fourth quarter of this year, Snapdragon 875G and Snapdragon 435G in the first quarter of next year, and Snapdragon 735G in the second quarter of next year.
Among them, Snapdragon 875G and Snapdragon 735G are manufactured using Samsung’s latest 8nm process, but it is said that the current yield rate of this process is not up to standard, which may affect Qualcomm’s plan.