According to digital chat site, MediaTek is about to launch a new 5G SoC, possibly named Dimensity 900 (MediaTek MT6877), with an engineering power score of around 480K, which is higher than Qualcomm Snapdragon 768G chip.
From the running point of view, the new MediaTek Dimensity will be the successor of Dimensity 820, becoming a thousand yuan gear and a heavyweight member.
At present, Realme Q3 Pro with Dimensity 1100 has achieved the price of 1599 yuan, and the terminal price of new Dimensity products with slightly lower positioning is expected to be lower.
Last year, MediaTek became the No. 1 company with several chips from the Dimensity range.
In the global smartphone market in 2020, MediaTek shipped 352 million mobile phone chips, up 48 percent year-on-year from 238 million in 2019, with a market share of 27 percent, ranking first, according to data released by market research institute Omdia.
Xiaomi has shipped more than 60m phones with MediaTek chips in the past year, and Huawei has bought a large number of MediaTek chips when Kirin was out of stock.
While introducing 5G chips, MediaTek has not forgotten the overseas market where 5G is not so developed. The Helio series, which is still being updated, gives more power to new overseas phones.
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Looking forward to 2021, MediaTek will probably continue to defend its shipment champion.