Foreign media in future reported that more and smarter phones are now on the market with the Snapdragon 855 chip, and the preliminary details about the successor of the Snapdragon 855 (temporarily called Snapdragon 865) are now exposed And will be shown later this year.
The previous model of the Snapdragon 855 was SM8150, codenamed “Hana”. The next-generation chip is temporarily called “Jilong 865”, and its internal model SM8250 is exposed. The development code may be “Project Kona”.
Similarly, “Kona” refers to the name of the Hawaiian Islands. Kona is not only an area on the main island of Hawaii but is often used as the name of the largest city on the island of Kailua-Kona. For several years, Qualcomm has been hosting the Snapdragon Technology Summit in Hawaii and launching its high-end processors in December.
Although there is no data on the clock frequency and similar details of the Snapdragon SM8250, the chip obviously supports LPDDR5 memory. The high-end chips of the Opteron 8cx for the Snapdragon 855 and Windows 10 devices still use LPDDR4X. Qualcomm has built a prototype of the new SM8250 internally and tested it with LPDDR5 memory, open to suppliers.
In July last year, Samsung Electronics announced that it has successfully developed the industry’s first 10 nanometers (nm) 8-gigabit (Gb) LPDDR5 DRAM. The 8Gb LPDDR5 data rate is up to 6400Mb/s, which is 1.5 times (4266Mb/s) of LPDDR4X.
In addition, the SDM55 chip named “Huracan” is also mentioned in the related documents, which is used on Qualcomm’s current development test platform (DTP). Depending on the name, this may be the version of the SDX55 5G modem for smartphones. However, this also means that even on the next generation of Qualcomm flagship chips, 5G modems are not necessarily part of the SoC package. Two chip variants may be introduced – one for Soc integration and one without integrated 5G support.