Today, ROG game mobile phone 6D (model ASUS_AI2203) obtained 3C certification, the relevant certification information shows that the machine supports 65W super fast charge.
Compared with ROG mobile phone 6, the biggest difference of ROG mobile phone 6D is that it is equipped with Mediatek Dimensity 9000+ flagship processor, which is the first Dimensity 9000+ esports mobile phone in the industry.
It is reported that Dimensity 9000+ uses TSMC 4NM technology, is Mediatek’s most powerful 5G mobile chip, Mediatek uses it to benchmark Qualcomm Snapdragon 8+.
In terms of parameters, the main frequency of Dimensity 9000+ super-large core Cortex-X2 is increased to 3.2ghz, and it is equipped with three 2.85ghz Cortex-A710 cores and four Cortex-A510 cores. The GPU is Arm mali-G710 MC10. CPU performance is improved by 5% and GPU performance is improved by 10%.
In terms of running score, Dimensity 9000+ CPU core is more than 1300 points, more than 4300 points, in the current Android chip performance is the best, can be called the strongest CPU Android.
In addition, as a game phone, strong heat dissipation is essential. Previously, ROG used matrix-type liquid-cooled heat dissipation architecture 6.0 on Snapdragon 8+ version, which is equipped with space-grade cooling material boron nitride to efficiently export CPU heat and rapidly expel heat with the help of the greatly increased area of the equalizing plate and graphene.
As a derivative,ROG Phone 6D, Dimensity 9000+ version, is also expected to use the cooling system.
With powerful heat dissipation and Mediatek’s strongest chip, ROG mobile 6D will become the “king of heaven”, and the new product is expected to debut in September.