Snapdragon 875: Supposed First Details of the Next High-End Mobile SoC


The 91mobiles website today released details of Qualcomm’s next mobile platform, the Snapdragon 875. The chip is expected to equip the top 2021 top-of-the-line phones, and most likely to be announced later this year when the Snapdragon Summit usually takes place.

Code-named SM8350, the Snapdragon 875 should bring the Kryo 685 cores, based on TSMC’s 5nm N5 process, accompanied by the Adreno 660 GPU and the Spectra 580 ISP. The chip’s performance level is not yet known, but considering the exchange of lithography, at least good gains in energy efficiency are expected.

One of the main novelties of the platform will be the 5G X60 modem, which will support mmWave and Sub-6 standards. There is still no confirmation as to whether the modem will be integrated or optional, along the lines of the current X55. Other chipset configurations also include:

Adreno 665 VPU
Quad-channel package-on-package (PoP) LPDDR5 high-speed SDRAM
Adreno 1095 DPU
Snapdragon Sensors Core technology
Qualcomm Secure Processing Unit (SPU250)
Low consumption audio subsystem with Aqstic Audio Technologies (codecs WCD9380 and WCD9385)

The Snapdragon 875 is also expected to continue to bring features present in Qualcomm’s current lineup, such as the ability for manufacturers to update chip drivers through app stores. Xiaomi was the first to use the technology, launching updates for the Mi 10 line and the Redmi K30 Pro in China.

It is worth remembering that Qualcomm must find strong competition from Samsung next year, at least in relation to the GPU of the new Exynos. The South Korean will use GPUs with AMD technology in its next chipset, which in leaked tests showed three times the performance found in the Adreno 650 of the Snapdragon 865.

Read Also: Xiaomi Mi Mix 4 Coming Soon? New Clues Directly From the Company

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