After running out in just 55 seconds in its first launch for sale in China, Xiaomi shows us the interior of Mi 10 Pro with great detail. Its dual stereo speaker, the large size of its 108MP photographic sensor and 5G modem are some of the hardware components that we will see below.
Once the Xiaomi Mi 10 Pro is opened, the brand shows us as the back of the smartphone, that is, on its cover, there are two rubber panels whose main objective is none other than to absorb shock in the event of a fall.
For its part, the first thing we find in the main body of the Xiaomi Mi 10 Pro is its NFC coil and its wireless charging base. In addition, from this same image, you can see the large size of its Thermo conductive graphite plate in order to improve cooling.
At each end of the new Xiaomi flagship, we found two stereo speakers housed in a large 1.22cc sound cavity. It should be noted that this sound cavity is larger than the one found in the Xiaomi Mi 10.
After removing the graphite cover we can see the large battery that is housed inside the Xiaomi Mi 10 Pro. A total of 4500mAh that occupy practically the entire height of the terminal. To its left, we find the mainboard or motherboard where all the hardware components are housed.
In addition, as we can see in the image above, the 108MP photographic sensor shows us its large size compared to the rest of the sensors. Also, under these, we can see the laser focus sensor and the LED Flash.
In its front part and located in the small hole of its screen, the Xiaomi Mi 10 Pro incorporates a 20MP selfie camera. Note that this sensor has been specially developed and designed to occupy the minimum possible space.
The next thing that we find inside the Xiaomi flagship is its «L» motherboard covered in copper and graphite sheets in order to improve heat dissipation. It integrates practically all the main hardware such as different connection chips or LPDDR5 RAM, UFS 3.0 storage or the powerful Snapdragon 865.
In addition, the motherboard is connected by FPC to a second board where the various chips in charge of the NFC or the screen controller itself are housed. Likewise, in this secondary board, there is a chip specialized in wireless charging capable of improving its performance.
Finally, Xiaomi shows us the large heat dissipation plate of the VC type (Steam Chamber). This has an area of no less than 3000 mm2 and works in turn synchronously with a large number of intelligent temperature sensors located along with the motherboard.
All components that allowed the Xiaomi Mi 10 Pro to overcome the Master Lu benchmark with a combined score of 469.692 points which allows it to reach the second position, immediately after the Nubia Red Magic 3S, which with its Snapdragon 855+ has obtained one score of 488,450 points.
To reward the Xiaomi Mi 10 were, among other things, the fluidity of use, the storage speed, the display update frequency, and the excellent software development.
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