Xiaomi MI 11 Screen First Revealed with Dig Hole and Snapdragon 875


In the second half of this year, Xiaomi demonstrated third-generation camera technology under the screen. Zeng Xuezhong, President of the mobile phone division of Xiaomi Corp, said the company’s third-generation under-screen camera technology has reached the level of mass production and will be commercially available next year.

Considering that xiaomi’s flagship phone is the Mi 11 series in the first half of next year, will the Mi 11 debut the camera technology under the screen?

Today, the blogger @digital Chat revealed that the Mi 11 series uses a hole digging scheme, with one in the upper left corner and one in the middle.

Earlier, @digital Chatter suggested that the holes would be moved to the center of the top and front of the flagship next year, similar to the Samsung Galaxy S20 series.

It is speculated that the top left corner of the hole is likely to be xiaomi mi 11, the middle hole is likely to be Xiaomi mi 11 Pro.

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Both will be the first commercially available Snapdragon 875 flagship processors. Judging from xiaomi’s previous moves, the Mi 11 series is likely to be the first snapdragon 875 chip in China.

It’s worth noting that Samsung’s Galaxy S21 series is rumored to be launched in January 2021, so if Xiaomi Is to win the first release, it won’t be until January at the latest, and a December release is not ruled out.


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