Today, the blog @Digital Chat website revealed that Mediatek Dimensity 8000 series iteration chips have been upgraded to TSMC 4nm process, and peripheral specifications such as 5G baseband, ISP and AI computing power have been strengthened. Redmi, RealMe and other manufacturers have started testing.
@digital chat station also revealed that Dimensity 8000 series iteration chip is expected to debut at the end of this year, which will be mediatek’s flagship second processor in 2023.
Data show that in the first half of this year, Mediatek mass produced commercial Dimensity 8000 and Dimensity 8100 chips, which are using TSMC 5nm process to benchmark Qualcomm Snapdragon 8 series flagship processors.
In terms of specifications, Dimensity 8100 consists of four Cortex-A78 cores with a 2.85ghz main frequency and four Cortex-A55 cores with a 2.0ghz main frequency. The GPU is Mali-G610 MC6, providing powerful performance.
As successor, Dimensity 8000 series iteration chips will use at least the Cortex A78 architecture, possibly upgrading to the Cortex A710 architecture, and Dimensity 8000 series iteration chips are likely to be around 900,000 points (currently, Dimensity 8100 has exceeded 800,000 points).
In addition, considering that Redmi K50, Redmi Note 11T Pro series and RealMe GT Neo3 series are Dimensity 8100 chips, it is speculated that Redmi K60 series may be Dimensity 8000 series iterative new products.
With TSMC’s 4nm process and powerful performance, Dimensity 8000 series iteration is likely to be the divine U of 2023, competing with Qualcomm’s Snapdragon 8 series.