Sony Mobile (previously known as Sony Ericsson Mobile) is a subsidiary of the electronics giant Sony Corporation. The company’s Xperia range that started off with Windows Mobile OS has moved to Android and is a significant part of the smartphone market today. The company markets some of its phones as waterproof and dustproof. Sony’s latest mobile launch is the Xperia R1 Plus. The smartphone was launched in October 2017. Today Sony’s another new smartphone named Xperia H8216 Specs has exposed on the web.
The Xperia H8216 is considered to be the next flagship device from Sony and expected to be released in early 2018. Sony’s new mobile configuration spy photos can be seen that it will carry Qualcomm Snapdragon 845 mobile platform.
As can be seen from the image, the Xperia H8216 sports a 5.48”Full-HD (1920×1080 pixels) HDR display with Sony’s Triluminos and X-Reality technology, The smartphone is powered by Qualcomm Snapdragon 845 SoC coupled with 4GB of Ram memory and 64GB of internal storage which can be further expanded via microSD card The Sony Xperia H8216 will feature a 15MP front shooter for selfies alongside the 12MP and 12MP dual camera setup on the rear and it runs on Android 8.1 Oreo operating system
The battery capacity of 3130mAh (not yet determined). The Sony Xperia H8216 measures 148×73.4×7.4mm and it weighs 156g. The smartphone will support rated IP65/68 dustproof and waterproof.
However, this information has not been confirmed by Sony mobile phones, but it is certain that Xperia H8216 does exist, the specific will be how we wait and see.
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