All kinds of news shows that Qualcomm’s next-generation flagship Snapdragon 855 processor will be named “Snapdragon 8150“. It is understood that the Snapdragon 8150 will be manufactured using TSMC’s 7nm FinFET process. In addition, the chip will be added to the independent NPU, which will usher in a substantial increase in AI, rather than the current “AIE”.
Qualcomm is doing what Huawei does with the Kirin 980: using three CPU core clusters on the SM8150 (SDM855) – 4 "Silver", 2 "Gold", 2 "Gold+" cores.
— Roland Quandt (@rquandt) October 28, 2018
Currently, the name of the Snapdragon 8150 processor has appeared in the Android 9 Pie system file and Bluetooth certification file. and According to the report of Roland Quandt, “Banlong 8150” will also adopt a three-cluster CPU core cluster design similar to Huawei Kirin 980. That is to say, this chip has 4 “Silver”, 2 “Gold”, 2 “Gold+” cores.
The data shows that the Kirin 980 is the world’s first commercial use of the Cortex-A76 architecture CPU and the Mali-G76 GPU. The CPU adopts 2 super large cores (based on Cortex-A76), 2 large cores (based on Cortex-A76), and 4 small core (Cortex-A55) 2+2+4 core designs. The single core performance is improved by 75% and the energy efficiency is improved.
Qualcomm’s next-generation chip will be manufactured using TSMC’s 7nm FinFET process. In addition, the chip will be added to the independent NPU, which will usher in a substantial increase in AI, rather than the current “AIE”. Finally, Roland Quandt also revealed that the Snapdragon 8150 will be released in Hawaii in December this year, which is Qualcomm’s annual summit.
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