Today, blogger Digital Chat suggested that the Mi 13 series will come in two screen schemes, the standard version with a straight screen and 1080P resolution, and the Pro version with a curved screen and 2K resolution, both of which will be in the middle of the hole.
Not only that, the digital chat station also revealed that the Mi 13 series bezels have been made narrower because of the new packaging technology.
It’s no surprise that the Mi 13 Series uses COP packaging, which directly twists and turns part of the screen to further shrink the bezel, a technology used only by mid-to-high-end flagships.
In addition, the Mi 13 series will all be powered by Qualcomm’s new Snapdragon 8 Gen2 flagship processor, which is still built on TSMC’s 4NM process.
According to revelations, Snapdragon 8 Gen2 uses the new “1+2+2+3” eight core architecture design, and Snapdragon 8+ “1+3+4” architecture comparison, the former more than a large core, less than a small core.
In addition, the Qualcomm Snapdragon 8 Gen2 has been upgraded to both supercore and large core. The supercore is upgraded to ARM Cortex X3, two large cores are upgraded to Cortex A720, and two large cores are Cortex A710 and the GPU is Adreno 740.
The chip is expected to be released as soon as November, followed by the Mi 13, and it’s possible that Xiaomi could get the right to debut again.